UCIe 2.0 Standard Released: Reshaping Chiplet Ecosystem

UCIe 2.0 Standard Released: Reshaping Chiplet Ecosystem

Published: February 2025

Standard Breakthrough:

Supports PCIe 7.0 interconnects with 1 TB/s die-to-die bandwidth.

TSMC/ASE co-develop 3D hybrid bonding verification tools.

Implementation Case: AMD Zen6 CPU + Xilinx AI engine heterogeneous integration achieves 40% efficiency boost.

Policy Context: China Chiplet Alliance debuts autonomous CXLink 2.0 protocol.

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